Since the invention of the first ever semiconductor package in 1965, semiconductor packaging technology has grown dramatically, and several thousands of different semiconductor package types have been made.From die-attach adhesives to liquid and film encapsulants, conductive coatings for EMI shieldings, first-level underfills such as liquid and film, to thermal interface materials and conductive and non-conductive adhesives for sensors and modules, today prospective customers can be surethat their needs will becovered by the most cutting edge and reliable technologies in the market. Since the introduction of Chip Scale Packages (CSP’s) only a few short years ago, they have become one of the biggest packaging trends in recent history. There are currently over 50 different types of CSP’s available throughout the industry, and the numbers are increasing almost daily.This technology is especially effective for the high pin count category. The flip-chip technology market is presently experiencing high growth due to advancements in the copper pillar and micro bumping metallurgy and its extended use in consumer electronics products and mobile phones. New bumping solutions are serving the most advanced packaging technologies; thus, flip-chip technology can adapt to meet new challenges.
To assist companies in finding accomplished solution providers, we have compiled this issue of Semiconductor Review. This edition lists the top 10 semiconductor packaging solution providers in 2021 to highlight the organizations that can escalate your growth chances. Equipped with innovative technological capabilities, these solution providers are set to transform the semiconductor packaging landscape. This edition also blends through thought leadership from subject-matter experts, CIOs, and CXOs, with real-life stories on how the solution providers have enhanced their clients’ capabilities. We hope this issue of Semiconductor Review helps you build the partnership you and your organization need to foster a workspace driven by robust and efficient technology.
We present to you Semiconductor Review’s “Top 10 Semiconductor Packaging Solution Companies - 2021.”
